(footprint "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "TSSOP, 28 Pin (Texas Instruments TAS5805M https://www.ti.com/lit/gpn/tas5805m), generated with kicad-footprint-generator ipc_gullwing_generator.py")
	(tags "TSSOP SO")
	(property "Reference" "REF**"
		(at 0 -5.8 0)
		(layer "F.SilkS")
	)
	(property "Value" "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm_ThermalVias"
		(at 0 5.8 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "" smd roundrect
		(at -0.775 -1.01)
		(size 1.25 1.63)
		(layers "F.Paste")
		(roundrect_rratio 0.2)
	)
	(pad "" smd roundrect
		(at -0.775 1.01)
		(size 1.25 1.63)
		(layers "F.Paste")
		(roundrect_rratio 0.2)
	)
	(pad "" smd rect
		(at 0 0)
		(size 3.1 4.05)
		(layers "F.Mask")
	)
	(pad "" smd roundrect
		(at 0.775 -1.01)
		(size 1.25 1.63)
		(layers "F.Paste")
		(roundrect_rratio 0.2)
	)
	(pad "" smd roundrect
		(at 0.775 1.01)
		(size 1.25 1.63)
		(layers "F.Paste")
		(roundrect_rratio 0.2)
	)
	(pad "1" smd roundrect
		(at -2.8625 -4.225)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "2" smd roundrect
		(at -2.8625 -3.575)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "3" smd roundrect
		(at -2.8625 -2.925)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "4" smd roundrect
		(at -2.8625 -2.275)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "5" smd roundrect
		(at -2.8625 -1.625)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "6" smd roundrect
		(at -2.8625 -0.975)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "7" smd roundrect
		(at -2.8625 -0.325)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "8" smd roundrect
		(at -2.8625 0.325)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "9" smd roundrect
		(at -2.8625 0.975)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "10" smd roundrect
		(at -2.8625 1.625)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "11" smd roundrect
		(at -2.8625 2.275)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "12" smd roundrect
		(at -2.8625 2.925)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "13" smd roundrect
		(at -2.8625 3.575)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "14" smd roundrect
		(at -2.8625 4.225)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "15" smd roundrect
		(at 2.8625 4.225)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "16" smd roundrect
		(at 2.8625 3.575)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "17" smd roundrect
		(at 2.8625 2.925)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "18" smd roundrect
		(at 2.8625 2.275)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "19" smd roundrect
		(at 2.8625 1.625)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "20" smd roundrect
		(at 2.8625 0.975)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "21" smd roundrect
		(at 2.8625 0.325)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "22" smd roundrect
		(at 2.8625 -0.325)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "23" smd roundrect
		(at 2.8625 -0.975)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "24" smd roundrect
		(at 2.8625 -1.625)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "25" smd roundrect
		(at 2.8625 -2.275)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "26" smd roundrect
		(at 2.8625 -2.925)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "27" smd roundrect
		(at 2.8625 -3.575)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "28" smd roundrect
		(at 2.8625 -4.225)
		(size 1.575 0.4)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "29" thru_hole circle
		(at -1.45 -4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 -3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 -1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 -0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at -1.45 4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 -4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 -3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 -1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 -0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" smd rect
		(at 0 0)
		(size 3.4 9.7)
		(property pad_prop_heatsink)
		(layers "F.Cu")
		(zone_connect 2)
	)
	(pad "29" smd rect
		(at 0 0)
		(size 3.4 9.7)
		(property pad_prop_heatsink)
		(layers "B.Cu")
		(zone_connect 2)
	)
	(pad "29" thru_hole circle
		(at 0 0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 0 4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 -4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 -3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 -1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 -0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 0.657143)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 1.971429)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 3.285714)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.45 4.6)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP3.4x9.7mm_Mask3.1x4.05mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
