(footprint "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm_ThermalVias"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "TSSOP, 28 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/lt3762.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
	(tags "TSSOP SO")
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		(layer "F.SilkS")
	)
	(property "Value" "TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm_ThermalVias"
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	(pad "29" thru_hole circle
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		(size 0.5 0.5)
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	(pad "29" thru_hole circle
		(at 0 2.125)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "29" thru_hole circle
		(at 1.12 -2.125)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
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	(pad "29" thru_hole circle
		(at 1.12 -0.708333)
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		(property pad_prop_heatsink)
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	(pad "29" thru_hole circle
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	(pad "29" thru_hole circle
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		(property pad_prop_heatsink)
		(layers "*.Cu")
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	)
	(model "${KICAD9_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-28-1EP_4.4x9.7mm_P0.65mm_EP2.74x4.75mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
