(footprint "TI_SO-PowerPAD-8_ThermalVias"
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	(layer "F.Cu")
	(descr "8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf")
	(tags "HTSOP 1.27")
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