(footprint "HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.57x1.88mm_ThermalVias"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
	(tags "HVSSOP SO")
	(property "Reference" "REF**"
		(at 0 -2.45 0)
		(layer "F.SilkS")
	)
	(property "Value" "HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.57x1.88mm_ThermalVias"
		(at 0 2.45 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "" smd roundrect
		(at -0.39 -0.47)
		(size 0.63 0.76)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at -0.39 0.47)
		(size 0.63 0.76)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at 0.39 -0.47)
		(size 0.63 0.76)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at 0.39 0.47)
		(size 0.63 0.76)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "1" smd roundrect
		(at -2.15 -1)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "2" smd roundrect
		(at -2.15 -0.5)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "3" smd roundrect
		(at -2.15 0)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "4" smd roundrect
		(at -2.15 0.5)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "5" smd roundrect
		(at -2.15 1)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "6" smd roundrect
		(at 2.15 1)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "7" smd roundrect
		(at 2.15 0.5)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "8" smd roundrect
		(at 2.15 0)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "9" smd roundrect
		(at 2.15 -0.5)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "10" smd roundrect
		(at 2.15 -1)
		(size 1.45 0.3)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "11" thru_hole circle
		(at -0.485 -0.64)
		(size 0.6 0.6)
		(drill 0.3)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "11" thru_hole circle
		(at -0.485 0.64)
		(size 0.6 0.6)
		(drill 0.3)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "11" smd rect
		(at 0 0)
		(size 1.57 1.88)
		(property pad_prop_heatsink)
		(layers "F.Cu" "F.Mask")
		(zone_connect 2)
	)
	(pad "11" smd rect
		(at 0 0)
		(size 1.57 1.88)
		(property pad_prop_heatsink)
		(layers "B.Cu")
		(zone_connect 2)
	)
	(pad "11" thru_hole circle
		(at 0.485 -0.64)
		(size 0.6 0.6)
		(drill 0.3)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "11" thru_hole circle
		(at 0.485 0.64)
		(size 0.6 0.6)
		(drill 0.3)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_SO.3dshapes/HVSSOP-10-1EP_3x3mm_P0.5mm_EP1.57x1.88mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
