(footprint "HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "HTSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
	(tags "HTSOP SO")
	(property "Reference" "REF**"
		(at 0 -3.4 0)
		(layer "F.SilkS")
	)
	(property "Value" "HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm_ThermalVias"
		(at 0 3.4 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "" smd roundrect
		(at -0.6 -0.8)
		(size 0.97 1.29)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at -0.6 0.8)
		(size 0.97 1.29)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at 0.6 -0.8)
		(size 0.97 1.29)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
		(at 0.6 0.8)
		(size 0.97 1.29)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "1" smd roundrect
		(at -2.65 -1.905)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "2" smd roundrect
		(at -2.65 -0.635)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "3" smd roundrect
		(at -2.65 0.635)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "4" smd roundrect
		(at -2.65 1.905)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "5" smd roundrect
		(at 2.65 1.905)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "6" smd roundrect
		(at 2.65 0.635)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "7" smd roundrect
		(at 2.65 -0.635)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "8" smd roundrect
		(at 2.65 -1.905)
		(size 1.6 0.6)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "9" thru_hole circle
		(at -0.95 -1.35)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at -0.95 0)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at -0.95 1.35)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" smd rect
		(at 0 0)
		(size 2.4 3.2)
		(property pad_prop_heatsink)
		(layers "F.Cu" "F.Mask")
		(zone_connect 2)
	)
	(pad "9" smd rect
		(at 0 0)
		(size 2.4 3.2)
		(property pad_prop_heatsink)
		(layers "B.Cu")
		(zone_connect 2)
	)
	(pad "9" thru_hole circle
		(at 0.95 -1.35)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at 0.95 0)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at 0.95 1.35)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_SO.3dshapes/HTSOP-8-1EP_3.9x4.9mm_P1.27mm_EP2.4x3.2mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
