(footprint "WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "WDFN, 8 Pin (https://www.onsemi.com/pub/Collateral/509AF.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py")
	(tags "WDFN NoLead")
	(property "Reference" "REF**"
		(at 0 -2.45 0)
		(layer "F.SilkS")
	)
	(property "Value" "WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm_ThermalVias"
		(at 0 2.45 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "" smd roundrect
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		(size 0.97 0.73)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
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		(size 0.97 0.73)
		(layers "F.Paste")
		(roundrect_rratio 0.25)
	)
	(pad "" smd roundrect
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		(size 0.97 0.73)
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		(roundrect_rratio 0.25)
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	(pad "" smd roundrect
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		(size 0.97 0.73)
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	)
	(pad "1" smd roundrect
		(at -1.9 -0.975)
		(size 0.9 0.25)
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		(roundrect_rratio 0.25)
	)
	(pad "2" smd roundrect
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		(size 0.9 0.25)
		(layers "F.Cu" "F.Paste" "F.Mask")
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	(pad "3" smd roundrect
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		(size 0.9 0.25)
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	)
	(pad "4" smd roundrect
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		(layers "F.Cu" "F.Paste" "F.Mask")
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	(pad "5" smd roundrect
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		(size 0.9 0.25)
		(layers "F.Cu" "F.Paste" "F.Mask")
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	)
	(pad "6" smd roundrect
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		(size 0.9 0.25)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "7" smd roundrect
		(at 1.9 -0.325)
		(size 0.9 0.25)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "8" smd roundrect
		(at 1.9 -0.975)
		(size 0.9 0.25)
		(layers "F.Cu" "F.Paste" "F.Mask")
		(roundrect_rratio 0.25)
	)
	(pad "9" thru_hole circle
		(at -0.95 -0.65)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at -0.95 0)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at -0.95 0.65)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" smd rect
		(at 0 0)
		(size 2.4 1.8)
		(property pad_prop_heatsink)
		(layers "F.Cu" "F.Mask")
		(zone_connect 2)
	)
	(pad "9" smd rect
		(at 0 0)
		(size 2.4 1.8)
		(property pad_prop_heatsink)
		(layers "B.Cu")
		(zone_connect 2)
	)
	(pad "9" thru_hole circle
		(at 0.95 -0.65)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at 0.95 0)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(pad "9" thru_hole circle
		(at 0.95 0.65)
		(size 0.5 0.5)
		(drill 0.2)
		(property pad_prop_heatsink)
		(layers "*.Cu")
		(remove_unused_layers no)
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/WDFN-8-1EP_4x3mm_P0.65mm_EP2.4x1.8mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
