(footprint "PQFN-8-EP_6x5mm_P1.27mm_Generic"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf")
	(tags "Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON")
	(property "Reference" "REF**"
		(at 0 -3.5 0)
		(layer "F.SilkS")
	)
	(property "Value" "PQFN-8-EP_6x5mm_P1.27mm_Generic"
		(at 0 4 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 180)
		(layer "F.Fab")
	)
	(pad "" smd rect
		(at -0.55 -1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at -0.55 0 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at -0.55 1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 0.3 -1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 0.3 0 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 0.3 1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 1.15 -1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 1.15 0 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 1.15 1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 2 -1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 2 0 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 2 1.15 90)
		(size 0.9 0.6)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 3 -1.905 90)
		(size 0.6 0.9)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 3 -0.635 90)
		(size 0.6 0.9)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 3 0.635 90)
		(size 0.6 0.9)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "" smd rect
		(at 3 1.905 90)
		(size 0.6 0.9)
		(layers "F.Paste")
		(zone_connect 0)
	)
	(pad "1" smd roundrect
		(at -2.725 -1.905 90)
		(size 0.7 1.15)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_paste_margin -0.05)
	)
	(pad "2" smd roundrect
		(at -2.725 -0.635 90)
		(size 0.7 1.15)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_paste_margin -0.05)
	)
	(pad "3" smd roundrect
		(at -2.725 0.635 90)
		(size 0.7 1.15)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_paste_margin -0.05)
	)
	(pad "4" smd roundrect
		(at -2.725 1.905 90)
		(size 0.7 1.15)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(solder_paste_margin -0.05)
	)
	(pad "5" smd custom
		(at 0 0 90)
		(size 4 2)
		(layers "F.Cu" "F.Mask")
		(zone_connect 2)
		(thermal_bridge_angle 45)
		(options
			(clearance outline)
			(anchor rect)
		)
		(primitives
			(gr_poly
				(pts
					(xy -2.35 3.5) (xy 2.35 3.5) (xy 2.35 2) (xy 2.1 2) (xy 2.1 -1.1) (xy -2.1 -1.1) (xy -2.1 2) (xy -2.35 2)
				)
				(width 0)
				(fill yes)
			)
		)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/PQFN-8-EP_6x5mm_P1.27mm_Generic.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
