(footprint "WLCSP-6_1.4x1.0mm_P0.4mm"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "6pin Pitch 0.4mm")
	(tags "6pin Pitch 0.4mm WLCSP")
	(property "Reference" "REF**"
		(at 0 -1.7 0)
		(layer "F.SilkS")
	)
	(property "Value" "WLCSP-6_1.4x1.0mm_P0.4mm"
		(at 0 1.8 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 -1.7 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -0.4 -0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(pad "A2" smd circle
		(at -0.4 0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(pad "B1" smd circle
		(at 0 -0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(pad "B2" smd circle
		(at 0 0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(pad "C1" smd circle
		(at 0.4 -0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(pad "C2" smd circle
		(at 0.4 0.2 90)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(solder_mask_margin 0.1)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/WLCSP-6_1.4x1.0mm_P0.4mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
