(footprint "ST_WLCSP-25_Die457"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "WLCSP-25, 2.133x2.07mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/resource/en/datasheet/stm32l011k3.pdf#page=100")
	(tags "CSP 25 0.4")
	(solder_mask_margin 0.0325)
	(solder_paste_margin 0.0125)
	(property "Reference" "REF**"
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				(thickness 0.15)
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	(property "Value" "ST_WLCSP-25_Die457"
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				(thickness 0.15)
			)
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	(attr smd)
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		(stroke
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		(fill solid)
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		(stroke
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		(stroke
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			(type solid)
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		(layer "F.Fab")
	)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
		(effects
			(font
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				(thickness 0.075)
			)
		)
	)
	(pad "A1" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "A2" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "A3" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "A4" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A5" smd circle
		(at 0.8 -0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B1" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "B2" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(pad "B3" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(pad "B4" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(pad "B5" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
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	(pad "C1" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C2" smd circle
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		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C3" smd circle
		(at 0 0)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C4" smd circle
		(at 0.4 0)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C5" smd circle
		(at 0.8 0)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D1" smd circle
		(at -0.8 0.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D2" smd circle
		(at -0.4 0.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D3" smd circle
		(at 0 0.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D4" smd circle
		(at 0.4 0.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "D5" smd circle
		(at 0.8 0.4)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E1" smd circle
		(at -0.8 0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E2" smd circle
		(at -0.4 0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E3" smd circle
		(at 0 0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
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	)
	(pad "E4" smd circle
		(at 0.4 0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "E5" smd circle
		(at 0.8 0.8)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-25_Die457.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)