(footprint "OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "OnSemi ODCSP8 (Case 570CS), 0.27mm pad, 3.16x3.16mm, 8 Ball, 3x3 Layout, 1.26mm Pitch, https://www.onsemi.com/pub/Collateral/570CS.PDF")
	(tags "CSP 8 1.26")
	(solder_mask_margin 0.1)
	(property "Reference" "REF**"
		(at 0 -2.58 0)
		(layer "F.SilkS")
	)
	(property "Value" "OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm"
		(at 0 2.58 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "+"
		(at 0.6 1.21 0)
		(layer "Cmts.User")
	)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -1.26 -1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A2" smd circle
		(at 0 -1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A3" smd circle
		(at 1.26 -1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B1" smd circle
		(at -1.26 0)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B3" smd circle
		(at 1.26 0)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C1" smd circle
		(at -1.26 1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C2" smd circle
		(at 0 1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C3" smd circle
		(at 1.26 1.26)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/OnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
