(footprint "Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf")
	(tags "CSP 15 0.4")
	(solder_mask_margin 0.0375)
	(property "Reference" "REF**"
		(at 0 -1.585 0)
		(layer "F.SilkS")
	)
	(property "Value" "Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm"
		(at 0 1.585 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -1 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A2" smd circle
		(at -0.6 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A3" smd circle
		(at -0.2 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A4" smd circle
		(at 0.2 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A5" smd circle
		(at 0.6 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A6" smd circle
		(at 1 -0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B1" smd circle
		(at -0.8 0)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B2" smd circle
		(at 0 0)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B3" smd circle
		(at 0.8 0)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C1" smd circle
		(at -1 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C2" smd circle
		(at -0.6 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C3" smd circle
		(at -0.2 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C4" smd circle
		(at 0.2 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C5" smd circle
		(at 0.6 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C6" smd circle
		(at 1 0.4)
		(size 0.25 0.25)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_CSP.3dshapes/Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
