(footprint "WLP-9_1.468x1.448mm_Layout3x3_P0.4mm"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "WLP-9, 1.468x1.448mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF")
	(tags "BGA 9 0.4")
	(solder_mask_margin 0.02)
	(solder_paste_margin 0.000001)
	(property "Reference" "REF**"
		(at 0 -1.724 0)
		(layer "F.SilkS")
	)
	(property "Value" "WLP-9_1.468x1.448mm_Layout3x3_P0.4mm"
		(at 0 1.724 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -0.4 -0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A2" smd circle
		(at 0 -0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A3" smd circle
		(at 0.4 -0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B1" smd circle
		(at -0.4 0)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B2" smd circle
		(at 0 0)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B3" smd circle
		(at 0.4 0)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C1" smd circle
		(at -0.4 0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C2" smd circle
		(at 0 0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "C3" smd circle
		(at 0.4 0.4)
		(size 0.27 0.27)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_BGA.3dshapes/WLP-9_1.468x1.448mm_Layout3x3_P0.4mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
