(footprint "WLP-4_0.728x0.728mm_Layout2x2_P0.35mm"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "WLP-4, 0.728x0.728mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf")
	(tags "BGA 4 0.35")
	(solder_mask_margin 0.02)
	(solder_paste_margin 0.000001)
	(property "Reference" "REF**"
		(at 0 -1.364 0)
		(layer "F.SilkS")
	)
	(property "Value" "WLP-4_0.728x0.728mm_Layout2x2_P0.35mm"
		(at 0 1.364 0)
		(layer "F.Fab")
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 0)
		(layer "F.Fab")
	)
	(pad "A1" smd circle
		(at -0.175 -0.175)
		(size 0.2 0.2)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "A2" smd circle
		(at 0.175 -0.175)
		(size 0.2 0.2)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B1" smd circle
		(at -0.175 0.175)
		(size 0.2 0.2)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(pad "B2" smd circle
		(at 0.175 0.175)
		(size 0.2 0.2)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Paste" "F.Mask")
	)
	(model "${KICAD9_3DMODEL_DIR}/Package_BGA.3dshapes/WLP-4_0.728x0.728mm_Layout2x2_P0.35mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
