(footprint "Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm"
	(version 20240108)
	(generator "kicad-footprint-generator")
	(layer "F.Cu")
	(descr "Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf")
	(tags "BGA 6 0.4")
	(solder_mask_margin 0.05)
	(property "Reference" "REF**"
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	(pad "C2" smd circle
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		(size 0.25 0.25)
		(property pad_prop_bga)
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	)
	(model "${KICAD9_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-6_0.95x1.488mm_Layout2x3_P0.4mm.wrl"
		(offset
			(xyz 0 0 0)
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		(scale
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		(rotate
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