(footprint "Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf)")
	(tags "Texas Instruments DSBGA BGA YFF S-XBGA-N5")
	(property "Reference" "REF**"
		(at 0 -1.8 0)
		(layer "F.SilkS")
	)
	(property "Value" "Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm"
		(at 0 1.8 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(solder_mask_margin 0.05)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 0 90)
		(layer "F.Fab")
	)
	(pad "" smd rect
		(at -0.2 -0.3465)
		(size 0.25 0.25)
		(layers "F.Paste")
	)
	(pad "" smd rect
		(at -0.2 0.3465)
		(size 0.25 0.25)
		(layers "F.Paste")
	)
	(pad "" smd rect
		(at 0 0)
		(size 0.25 0.25)
		(layers "F.Paste")
	)
	(pad "" smd rect
		(at 0.2 -0.3465)
		(size 0.25 0.25)
		(layers "F.Paste")
	)
	(pad "" smd rect
		(at 0.2 0.3465)
		(size 0.25 0.25)
		(layers "F.Paste")
	)
	(pad "A1" smd circle
		(at -0.2 -0.3465)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
	)
	(pad "A3" smd circle
		(at 0.2 -0.3465)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
	)
	(pad "B2" smd circle
		(at 0 0)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
	)
	(pad "C1" smd circle
		(at -0.2 0.3465)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
	)
	(pad "C3" smd circle
		(at 0.2 0.3465)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_BGA.3dshapes/Texas_DSBGA-5_0.822x1.116mm_Layout2x1x2_P0.4mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
