(footprint "EPC_BGA-4_0.9x0.9mm_Layout2x2_P0.45mm"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "EPC BGA-4, 0.9x09mm, Pitch 0.4mm, https://epc-co.com/epc/Portals/0/epc/documents/datasheets/EPC2035_datasheet.pdf")
	(tags "EPC BGA-4")
	(property "Reference" "REF**"
		(at 0 -2.075 0)
		(layer "F.SilkS")
	)
	(property "Value" "EPC_BGA-4_0.9x0.9mm_Layout2x2_P0.45mm"
		(at 0 1.3 0)
		(unlocked yes)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 -1 0)
		(unlocked yes)
		(layer "F.Fab")
	)
	(pad "" smd roundrect
		(at -0.225 -0.225)
		(size 0.25 0.25)
		(layers "F.Paste")
		(roundrect_rratio 0.2884615385)
	)
	(pad "" smd roundrect
		(at -0.225 0.225)
		(size 0.25 0.25)
		(layers "F.Paste")
		(roundrect_rratio 0.2884615385)
	)
	(pad "" smd roundrect
		(at 0.225 -0.225)
		(size 0.25 0.25)
		(layers "F.Paste")
		(roundrect_rratio 0.2884615385)
	)
	(pad "" smd roundrect
		(at 0.225 0.225)
		(size 0.25 0.25)
		(layers "F.Paste")
		(roundrect_rratio 0.2884615385)
	)
	(pad "1" smd circle
		(at -0.225 -0.225)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
		(solder_mask_margin -0.01)
	)
	(pad "2" smd circle
		(at -0.225 0.225)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
		(solder_mask_margin -0.01)
	)
	(pad "3" smd circle
		(at 0.225 -0.225)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
		(solder_mask_margin -0.01)
	)
	(pad "4" smd circle
		(at 0.225 0.225)
		(size 0.225 0.225)
		(property pad_prop_bga)
		(layers "F.Cu" "F.Mask")
		(solder_mask_margin -0.01)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Package_BGA.3dshapes/EPC_BGA-4_0.9x0.9mm_Layout2x2_P0.45mm.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
