(footprint "Heatsink_AAVID_590302B03600G"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "Heatsink, 25.4x25.4x42.54mm, TO-220, https://www.boydcorp.com/aavid-datasheets/Board-Level-Cooling-Channel-5903.pdf")
	(tags "heatsink")
	(property "Reference" "REF**"
		(at 2.54 -2.96 0)
		(layer "F.SilkS")
	)
	(property "Value" "Heatsink_AAVID_590302B03600G"
		(at 2.54 27.04 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(attr through_hole)
	(fp_text user "${REFERENCE}"
		(at 2.54 12.04 0)
		(layer "F.Fab")
	)
	(pad "1" thru_hole oval
		(at 0 0)
		(size 5.05 3)
		(drill oval 3.55 1.5)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(pad "2" thru_hole oval
		(at 0 24.08)
		(size 5.05 3)
		(drill oval 3.55 1.5)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Heatsink.3dshapes/Heatsink_AAVID_590302B03600G.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
