(footprint "USB_C_Receptacle_Molex_105450-0101"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "USB 3.0 3.1 3.2 4.0 Type-C receptable, through-hole mount, SMD, right-angle (https://www.molex.com/pdm_docs/sd/1054500101_sd.pdf)")
	(tags "USB C Type-C USB3 receptacle SMD")
	(property "Reference" "REF**"
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		(unlocked yes)
		(layer "F.SilkS")
	)
	(property "Value" "USB_C_Receptacle_Molex_105450-0101"
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		(layer "F.Fab")
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	(property "Datasheet" ""
		(at 0 0 0)
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		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(unlocked yes)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(fp_text user "PCB Edge"
		(at 0 3.875 0)
		(unlocked yes)
		(layer "Dwgs.User")
	)
	(fp_text user "${REFERENCE}"
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	(pad "S1" thru_hole oval
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		(size 1.1 2.1)
		(drill oval 0.6 1.6)
		(property pad_prop_heatsink)
		(layers "*.Cu" "*.Mask")
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	)
	(pad "S1" thru_hole oval
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		(size 1.1 2.6)
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		(property pad_prop_heatsink)
		(layers "*.Cu" "*.Mask")
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	(pad "S1" thru_hole oval
		(at 4.32 -2.805)
		(size 1.1 2.1)
		(drill oval 0.6 1.6)
		(property pad_prop_heatsink)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(pad "S1" thru_hole oval
		(at 4.32 2.555)
		(size 1.1 2.6)
		(drill oval 0.6 2.1)
		(property pad_prop_heatsink)
		(layers "*.Cu" "*.Mask")
		(remove_unused_layers no)
	)
	(zone
		(net 0)
		(net_name "")
		(layers "F.Cu" "Dwgs.User")
		(hatch full 0.508)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.254)
		(filled_areas_thickness no)
		(keepout
			(tracks not_allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour not_allowed)
			(footprints not_allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.508)
			(thermal_bridge_width 0.508)
		)
		(polygon
			(pts
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			)
		)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Connector_USB.3dshapes/USB_C_Receptacle_Molex_105450-0101.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
