(footprint "nanoSIM_Hinged_CUI_NSIM-2-C"
	(version 20241229)
	(generator "pcbnew")
	(generator_version "9.0")
	(layer "F.Cu")
	(descr "Hinged nano SIM holder, 6 pin, with normally open card detection switch to GND: https://www.cuidevices.com/product/resource/nsim-2-c.pdf")
	(tags "SIM holder nano 4FF")
	(property "Reference" "REF**"
		(at 0 -8.7 0)
		(layer "F.SilkS")
	)
	(property "Value" "nanoSIM_Hinged_CUI_NSIM-2-C"
		(at 0 8.8 0)
		(layer "F.Fab")
	)
	(property "Datasheet" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(property "Description" ""
		(at 0 0 0)
		(layer "F.Fab")
		(hide yes)
	)
	(attr smd)
	(fp_text user "${REFERENCE}"
		(at 0 -5.3 0)
		(layer "F.Fab")
	)
	(fp_text user "LOCK"
		(at 4.5 4.8 270)
		(unlocked yes)
		(layer "F.Fab")
	)
	(fp_text user "OPEN"
		(at -4.8 0.8 90)
		(unlocked yes)
		(layer "F.Fab")
	)
	(pad "1" smd roundrect
		(at -3.175 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "2" smd roundrect
		(at -0.635 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "3" smd roundrect
		(at 1.905 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "5" smd roundrect
		(at -1.905 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "6" smd roundrect
		(at 0.635 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "7" smd roundrect
		(at 3.175 -6.8)
		(size 0.9 1.2)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.25)
		(thermal_bridge_angle 45)
	)
	(pad "CD" smd roundrect
		(at -5.85 6.1)
		(size 1.3 1.8)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1923076923)
		(thermal_bridge_angle 45)
	)
	(pad "SH" smd roundrect
		(at -5.85 -2.7)
		(size 1.3 1.8)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1923076923)
		(thermal_bridge_angle 45)
	)
	(pad "SH" smd roundrect
		(at 5.85 -2.7)
		(size 1.3 1.8)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1923076923)
		(thermal_bridge_angle 45)
	)
	(pad "SH" smd roundrect
		(at 5.85 6.1)
		(size 1.3 1.8)
		(layers "F.Cu" "F.Mask" "F.Paste")
		(roundrect_rratio 0.1923076923)
		(thermal_bridge_angle 45)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy -3.89 2.6) (xy -3.89 6.3) (xy -1.49 6.3) (xy -1.49 2.6)
			)
		)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy -3.19 -4.4) (xy -3.19 -0.7) (xy -1.89 -0.7) (xy -1.89 -4.4)
			)
		)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy -0.65 -4.4) (xy -0.65 -0.7) (xy 0.65 -0.7) (xy 0.65 -4.4)
			)
		)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy -0.65 2.6) (xy -0.65 6.3) (xy 0.65 6.3) (xy 0.65 2.6)
			)
		)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy 1.89 -4.4) (xy 1.89 -0.7) (xy 3.19 -0.7) (xy 3.19 -4.4)
			)
		)
	)
	(zone
		(net 0)
		(net_name "")
		(layer "F.Cu")
		(hatch edge 0.5)
		(connect_pads
			(clearance 0)
		)
		(min_thickness 0.25)
		(filled_areas_thickness no)
		(keepout
			(tracks allowed)
			(vias not_allowed)
			(pads not_allowed)
			(copperpour allowed)
			(footprints allowed)
		)
		(placement
			(enabled no)
			(sheetname "")
		)
		(fill
			(thermal_gap 0.5)
			(thermal_bridge_width 0.5)
		)
		(polygon
			(pts
				(xy 1.89 2.6) (xy 1.89 6.3) (xy 3.19 6.3) (xy 3.19 2.6)
			)
		)
	)
	(embedded_fonts no)
	(model "${KICAD9_3DMODEL_DIR}/Connector_Card.3dshapes/nanoSIM_Hinged_CUI_NSIM-2-C.wrl"
		(offset
			(xyz 0 0 0)
		)
		(scale
			(xyz 1 1 1)
		)
		(rotate
			(xyz 0 0 0)
		)
	)
)
